Title

The Duo of Artificial Intelligence and Big Data for Industry 4.0: Applications, Techniques, Challenges, and Future Research Directions

Document Type

Article

Publication Title

IEEE Internet of Things Journal

Abstract

The increasing need for economic, safe, and sustainable smart manufacturing combined with novel technological enablers has paved the way for Artificial Intelligence (AI) and big data in industries. This implies a substantial integration of AI, Industrial Internet of Things (IIoT), Robotics, big data, Blockchain, and 5G communications in support of smart manufacturing and the dynamical processes in modern industry. In this paper, we provide a comprehensive overview of different aspects of AI and big data in Industry 4.0 with a particular focus on key applications, techniques, the concepts involved, key enabling technologies, challenges, and research perspective towards deployment of Industry 5.0. In detail, we highlight and analyze how the duo of AI and big data is helping in different applications of Industry 4.0. We also highlight key challenges in a successful deployment of AI and big data solutions in smart industrial applications with a particular emphasis on data-related issues, such as availability, bias, auditing, management, interpretability, communication, and different adversarial attacks and security issues. Finally, we explore the significance of AI and big data towards Industry 4.0 applications through panoramic reviews and discussions. This work is expected to provide a baseline for future research in the domain.

DOI

10.1109/JIOT.2021.3139827

Publication Date

12-31-2021

Keywords

5G networks, artificial intelligence, big data, data issues, fourth industrial revolution, Industrial Internet of Things, industry 4.0, Internet of Things (IoT), smart manufacturing

Comments

IR deposit conditions:

  • OA version (accepted version) - pathway a
  • No embargo
  • When accepted for publication, set statement to accompany deposit (see policy)
  • Must link to publisher version with DOI
  • Publisher copyright and source must be acknowledged

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